Although the deadline for the Bill Zito scholarship is quickly approaching, you still have time to tell a packaging student you know about this fabulous opportunity. Bill pioneered the induction cap sealing product line for Enercon and taught us all the ins and outs of the sealing process.

I was fortunate to learn from one of the best in the industry and am excited that another student of packaging will get the opportunity to learn because of him. If you know someone who might be interested, the details are below.

Contact our friends at PMMI to apply. The Bill Zito Scholarship was established by Enercon and it is administered by the PMMI Education & Training Foundation. This one-time $2,100 scholarship will be awarded to a student enrolled in a two- or four-year program at any of PMMI’s Partner schools.

When applying for the Bill Zito scholarship, students must:
  • Have a GPA of 3.0 or higher
  • Be majoring in packaging engineering or a related area
  • Demonstrate a commitment to excellence in the packaging industry
  • Be currently enrolled in the program
  • Have a financial need
  • Demonstrate extra-curricular involvement, such as athletics
  • Have a recommendation from faculty
Students wishing to apply for this scholarship should submit an essay describing their interest in the packaging field, and their career goals.

The deadline to apply for this scholarship is November 25, 2011. Any students planning to enroll in the 2012 spring semester are encouraged to apply.

For additional information, please contact Danny Martinez, PMMI Education Coordinator by Phone: 571-612-3204, Fax: 703-243-8556 or by e-mail at

Posted: 11/17/2011 9:57:41 PM by Ryan Schuelke