Atmospheric plasma cleans and functionalizes surfaces of three dimensional photovoltaics module components such as polymer-based junction boxes to improve potting adhesive bonding. It also promotes bonding to glass, silicon wafers and aluminum structures.
Silicon wafer cleaning processes have technologically progressed from aqueous, or wet, chemical cleaning and etching approaches to a wide range of alternative dry processes. Enercon’s Dyne-A-Mite™ atmospheric plasma technology for three-dimensional surfaces is being used as an alternative for removing organic-based layers and residues, and also prepping the surface to promote adhesion of materials.
These atmospheric plasma regimes can also be found being used in conjunction with supercritical phase carbon dioxide fluid (“snow cleaning”) devices for removing particle contaminations where wet chemical approaches can either not be employed or are being reduced due to VOC emission issues.
Surface modification challenges in photovoltaics cell manufacturing protocols include edge etching and cleaning, metal oxide removal, the removal of organic and inorganic contaminations, removal of photoresist, surface ashing and descumming, surface roughening to improve bondability, and surface activation to improve liquid wettability and wetting uniformity.