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Next Thursday May 17 we'll be hosting our next webinar which focuses on ways you can boost the productivity of your induction cap sealer. Your Enercon cap sealing system comes standard with a variety of features that when leveraged can help you more tightly control your process and help ensure you achieve a perfect seal. In addition we offer a number of performance enhancing options which can greatly enhance your quality control process.

During the webinar we'll talk about these features and options as well as how you can use them to boost your productivity. We'll take questions throughout the webinar, so bring us your toughest questions. Sign up today - we look forward to seeing you next week!

Posted: 5/9/2012 12:17:49 PM by Ryan Schuelke


This past Sunday about 40 member of the packaging community got their hands dirty at Fisher House in San Antonio. PMMI offered attendees of their Executive Leadership Conference the opportunity to spend a few hours helping spruce up the grounds of this great home for the families of rehabilitating veterans.

The Fisher House Foundation and their homes across the country are much like what many of us know as Ronald McDonald Houses. Fisher House focuses on providing a home for families to stay while their son, daughter, husband or wife recovers from injuries suffered while defending our country.

We can all be proud of how generous members of the packaging community are!

Posted: 4/19/2012 9:15:04 AM by Ryan Schuelke


Do you like salt? How about a jalapeno salt? Sound tasty? Our friends at Packaging Digest just published an article about Saltworks who made the switch from pressure sensitive liners to heat induction seals on their line of artisanal salts. I can tell you they are delectable!

If you're looking to replace your PS seals with and induction seal, check out our line-up of Super Seal cap sealing machines and contact us today!

Posted: 4/13/2012 12:28:09 PM by Ryan Schuelke


Over the past couple weeks I've been out and about on the streets of Asia visiting packagers of a wide array of products. What is truly amazing is that as large as the world is packaging professionals are all facing the same challenges. 

When it comes to induction cap sealing, one of the common questions we receive, "How do we ensure consistent seals?" The answer is the same no matter where in the world you are - consistency. Over the next few weeks I'll share with you a tip on how to create consistency in your process.

Consistent gap between your sealing head and the top of your package's closure is vital. Regardless of the distance - some use a 3mm gap, others use 5mm, still others use 10mm - the most important aspect is that each time you setup your machine it is consistent from run to run. Check out our a video that illustrates the process of setting the gap.

Keep in mind the distance between the sealing head does impact the power level you'll set your induction cap sealing machine. You'll need more power to seal the same package with a 5mm gap as you would with a 3mm gap.

If you need one of the handy gap gauges highlighted in the video, drop us a note and we will get one to you.

Posted: 3/14/2012 8:40:07 AM by Ryan Schuelke


Although the deadline for the Bill Zito scholarship is quickly approaching, you still have time to tell a packaging student you know about this fabulous opportunity. Bill pioneered the induction cap sealing product line for Enercon and taught us all the ins and outs of the sealing process.

I was fortunate to learn from one of the best in the industry and am excited that another student of packaging will get the opportunity to learn because of him. If you know someone who might be interested, the details are below.

Contact our friends at PMMI to apply. The Bill Zito Scholarship was established by Enercon and it is administered by the PMMI Education & Training Foundation. This one-time $2,100 scholarship will be awarded to a student enrolled in a two- or four-year program at any of PMMI’s Partner schools.

When applying for the Bill Zito scholarship, students must:
  • Have a GPA of 3.0 or higher
  • Be majoring in packaging engineering or a related area
  • Demonstrate a commitment to excellence in the packaging industry
  • Be currently enrolled in the program
  • Have a financial need
  • Demonstrate extra-curricular involvement, such as athletics
  • Have a recommendation from faculty
Students wishing to apply for this scholarship should submit an essay describing their interest in the packaging field, and their career goals.

The deadline to apply for this scholarship is November 25, 2011. Any students planning to enroll in the 2012 spring semester are encouraged to apply.

For additional information, please contact Danny Martinez, PMMI Education Coordinator by Phone: 571-612-3204, Fax: 703-243-8556 or by e-mail at danny@pmmi.org.

Posted: 11/17/2011 9:57:41 PM by Ryan Schuelke